Intel releases the world's first 3D transistor

     
What is being called one of the most significant transistor design changes since the 1950’s, Intel has officially created a 3D transistor. Now many companies are jumping on the 3D bandwagon making 3D phones, tablets, and TV’s; but Intel’s new transistor design finally completes a design goal of CPU manufactures for the last decade. Every year or 2 Intel or AMD has a die shrink, which is creating smaller transistors in the CPU, allowing them to place more of them in a smaller area and lowers heat and power consumption. The problem with this is that you can only shrink the transistors so many times before you hit an size so small that you can’t physically shrink the transistors anymore. This hasn’t happened yet, but looms over the horizon forcing both Intel and AMD to start planning on how they are going to over come this obstacle.

Intel’s new Tri-gate design uses a 22-nanometer process with a "fin" jutting up from the base giving it a third dimension. This small improvement over Intel’s current 32nm Sandybridge CPU’s will give their upcoming Ivybridge CPU a 37% increase in speed while still using the same amount of energy as the Sandybridge CPUs. This new breakthrough is Intel’s next move as they try to enter the mobile market that is dominated by ARM cpu’s that use extremely little power, something that Intel has not been able to compete with before. These new CPU’s should be available to consumers in 2012 with pricing and models information not being released at this time.

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President of NSI, Tom has been helping small and medium businesses succeed in Connecticut for over 25 years.